发明名称 |
Compound Semiconductor Integrated Circuit and Method to Fabricate Same |
摘要 |
A structure includes a substrate having a surface and a first transistor disposed in a first region supported by the surface of the substrate. The first transistor has a channel formed in a first compound (Group III-V) semiconductor having a first energy bandgap. The structure further includes a second transistor disposed in a second region supported by the substrate. The second transistor has a channel formed in a second compound (Group III-V) semiconductor having a second energy bandgap that is larger than the first energy bandgap. In one embodiment the first compound semiconductor is a layer that overlies a first portion of the surface of the substrate and the substrate is the second compound semiconductor. In another embodiment the second compound semiconductor is provided as a second layer that overlies a second portion of the surface of the substrate. |
申请公布号 |
US2015041856(A1) |
申请公布日期 |
2015.02.12 |
申请号 |
US201314011797 |
申请日期 |
2013.08.28 |
申请人 |
International Business Machines Corporation |
发明人 |
Cheng Kangguo;Doris Bruce B.;Hashemi Pouya;Khakifirooz Ali;Reznicek Alexander |
分类号 |
H01L29/20;H01L27/088 |
主分类号 |
H01L29/20 |
代理机构 |
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代理人 |
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主权项 |
1. A structure, comprising:
a substrate having a surface; a first transistor disposed in a first region supported by the surface of the substrate, the first transistor having a channel formed in a first compound semiconductor material having a first energy bandgap; and a second transistor disposed in a second region supported by the substrate, the second transistor having a channel formed in a second compound semiconductor material having a second energy bandgap that is larger than the first energy bandgap. |
地址 |
Armonk NY US |