MICROFLUIDIC SENSOR PACKAGE STRUCTURE AND METHOD

摘要

In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having one or more open channels, sealed channels, and/or a sealed chamber exposing an active surface of the microfluidic sensor. The molded panel portions and mask portions are configured to allow a material to dynamically or statically contact the microfluidic sensor for analysis.

主权项

1. A microfluidic chip package, comprising:
a micro lead frame including a chip-mounting plate and a plurality of leads arranged around the chip-mounting plate in all directions such that they are flush with the chip-mounting plate; a microfluidic chip disposed on the chip-mounting plate of the micro lead frame; a conductive connector electro-conductively connecting the microfluidic chip and each of the leads; and a molding compound resin panel disposed on the entire upper surface of the micro lead frame to cover the microfluidic chip and provided with a space for containing a material to be analyzed, the space configured to expose a part of the upper surface of the microfluidic chip.