| 摘要 |
<p>The present invention relates to a device package in which a device dissipating heat when operated is mounted. The device package includes: a base substrate including a mounting part having a surface on which the device is mounted; an intermediate body arranged at least an area of one surface of the base substrate except the mounting part; an insulation body which is arranged on at least an area of one surface of the intermediate body except the mounting part of one surface of the base substrate, and on a portion of a side surface of the base substrate; and an electrode which is combined with the insulation body and is electrically connected with the device. The base substrate is formed to have a structure on which a copper (Cu) layer and a molybdenum (Mo) layer are laminated. Therefore, a thermal expansion coefficient and thermal conductivity of the base substrate are maintained to be similar to those of the intermediate body; thus, deformation or damage caused by heat generated by the device can be inhibited or prevented.</p> |
