SINGLE SOLUTION FOR ELECTRO-ELECTROLESS DEPOSITION OF METALS

摘要

A hybrid electro-electroless deposition process whereby multiple metal films layers are deposited from a single plating solution which includes both electroless and electroplating components. The article to be plated is immersed in the solution, and electric current is selectively applied at determined voltages for predetermined times, at selected intervals to effect electroplating in conjunction with electroless deposition. Electroplated metal layers are interspersed with electroless deposited metal layers.