发明名称 |
Collimator bonding structure and method |
摘要 |
<p>An image sensor is disclosed that includes a solid state semiconductor imager having a metallized catch pad, a collimator having a metallized layer that faces a sensor anode, the metallized layer joined with the metallized catch pad to form a metal bond between the solid state semiconductor imager and the collimator. Methods of making the joined solid state semiconductor imager and collimator assembly are also disclosed.</p> |
申请公布号 |
AU2011289856(B2) |
申请公布日期 |
2015.02.12 |
申请号 |
AU20110289856 |
申请日期 |
2011.04.21 |
申请人 |
INTEVAC, INC. |
发明人 |
COSTELLO, KENNETH A.;RODERICK, KEVIN J.;YIN, EDWARD;FOWLER, DOUGLAS |
分类号 |
B23K1/00;B29C65/48;B29C65/52;H04N5/335 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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