发明名称 半導体製造工程用テープの基材フィルム
摘要 <p>[Problem] Provide a base film of a tape for a semiconductor production process. [Solution] The base film of a tape for a semiconductor production process is a substrate film formed from A) an ionomer resin that is obtained by subjecting a dipolymer, the polymer structural units of which are ethylene and (meth)acrylic acid, to crosslinking by metal ions, and B) a substance containing a terpolymer, the polymer structural components of which are ethylene, (meth)acrylic acid, and (meth)acrylic acid alkyl ester, wherein the amount of component B) used is within a range of at least 5 mass% to no more than 50 mass% on the basis of the total amount of components A) + B).</p>
申请公布号 JP5666875(B2) 申请公布日期 2015.02.12
申请号 JP20100236363 申请日期 2010.10.21
申请人 发明人
分类号 H01L21/301;C09J7/02 主分类号 H01L21/301
代理机构 代理人
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