| 发明名称 |
PREPREG AND LAMINATED BOARD |
| 摘要 |
To provide a prepreg that achieves a low dielectric loss tangent, despite the use of a polar solvent.;A prepreg produced by impregnating or coating a base material with a varnish comprising an inorganic filler, a polar solvent, and a resin composition principally comprising polyphenylene ether, and subjecting the base material treated to a drying step, wherein the polar solvent content of the prepreg is 3 mass % or less, and a dielectric loss tangent at 10 GHz of a laminated board produced using this prepreg is 0.001-0.007. |
| 申请公布号 |
US2015044484(A1) |
申请公布日期 |
2015.02.12 |
| 申请号 |
US201314381784 |
申请日期 |
2013.03.21 |
| 申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
Ito Shoichi;Yaginuma Michio;Oka Naoki;Kudo Masataka |
| 分类号 |
H05K1/03;C08L71/12;C08K3/00;H01B3/42;B32B15/08 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A prepreg produced by impregnating or coating a base material with a varnish comprising an inorganic filler, a polar solvent, and a resin composition principally comprising polyphenylene ether, and subjecting the base material treated to a drying step, wherein
the polar solvent content of the prepreg is 3 mass % or less, and a dielectric loss tangent at 10 GHz of a laminated board produced using this prepreg is 0.001-0.007. |
| 地址 |
Tokyo JP |
