SUBSTRATE BACKSIDE TEXTURING

摘要

Embodiments described relate to a method and apparatus for reducing lithographic distortion. A backside of a semiconductor substrate may be texturized. Then a lithographic process may be performed on the semiconductor substrate having the texturized backside.

主权项

1. A method for determining backside texturing of a semiconductor substrate that is processed on a photolithography tool, comprising:
determining one or more contact areas on the photolithography tool for the semiconductor substrate; determining a backside surface texturing for the semiconductor substrate that is based, at least in part, on:
a frequency of backside features of the semiconductor substrate at one or more portions of the semiconductor substrate,an amplitude of the backside features at the one or more portions of the semiconductor substrate, ora size of the one or more contact areas; and processing the semiconductor substrate to obtain a target backside surface texturing that reduces the coefficient of friction between the substrate and the one or more contact areas.