发明名称 |
PACKAGING-BEFORE-ETCHING FLIP CHIP 3D SYSTEM-LEVEL METAL CIRCUIT BOARD STRUCTURE AND TECHNIQUE THEREOF |
摘要 |
Provided are a packaging-before-etching flip chip 3D system-level metal circuit board structure and technique thereof. The metal circuit board structure comprises a metal substrate frame (1); the front face of the metal substrate frame (1) is provided with pins (3); the front faces of the pins (3) are provided with conductive posts (4); chips (5) are installed in a flip manner between the pins (3) via underfills (16); the peripheral areas of the pins (3), the conductive posts (4) and the chips (5) are encapsulated with molding compound (7), the top of the molding compound (7) being parallel to the tops of the conductive posts (4); and the surfaces of the metal substrate frame (1), the pins (3) and the conductive posts (4) exposing out of the molding compounds (7) are provided with an anti-oxidation layer (6), thus solving the problem of limited functionality and application of a traditional metal lead frame due to the fact that objects cannot be embedded therein. |
申请公布号 |
WO2015018145(A1) |
申请公布日期 |
2015.02.12 |
申请号 |
WO2013CN88376 |
申请日期 |
2013.12.03 |
申请人 |
JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD |
发明人 |
LIANG, STEVE XIN;LIANG, CHIH-CHUNG;LIN, YU-BIN;WANG, YAQIN;ZHANG, YOUHAI |
分类号 |
H01L21/48;H01L21/56;H01L23/31;H01L23/495 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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