| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for designing a tip shape of a cutting tool capable of suppressing breakage not only when the situation is normal, but also when a trench shape of a narrower and shallower surface side is used, a method for manufacturing a semiconductor strip, a circuit board and electronic equipment.SOLUTION: A method comprises: a step (S200) of preparing a plurality of cutting tools having different degrees of taper of tips in a step of forming a trench at a front surface side on the front surface of a substrate and a step of forming a trench at a back surface side reaching the trench at the front surface side by a rotating cutting tool having a thickness being thicker than a width of the trench at the front surface side from the back surface of the substrate, and of dicing the substrate into a semiconductor strip; a step (S202) of preparing a plurality of trenches at the front surface side having same shape; a step (S204) of checking a breakage status that the trench at the back surface side is formed by a plurality of cutting tools; and a step (S210) of selecting degree of taper of the cutting tool not to be damaged as a tip shape of the cutting tool used in a mass-production process when both of the cutting tool to be damaged and the cutting tool to be damaged are included as a result of this. |
