| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring shape appropriate for ensuring dielectric strength voltage between adjacent interconnections, improving adhesion of a wiring layer and ensuring interlayer withstand voltage when formed as a laminated structure.SOLUTION: A wiring board comprises: a support substrate; a wettability change layer which is installed on a top face of the support substrate and contains a material having a critical surface tension which changes depending on energy deposition; and a conductive layer inside a recess formed on the wettability change layer. The recess is formed to have tapered planes where both side walls of the recess incline downward in a cross sectional shape orthogonal to a conduction direction of the conductive layer, and upper edges of both side walls are formed in gentle curved surfaces.</p> |
