| 发明名称 |
Method and Apparatus for Cleaning A Semiconductor Substrate |
| 摘要 |
A method for cleaning a substrate is provided. The method initiates with disposing a fluid layer having solid components therein to a surface of the substrate. A shear force directed substantially parallel to the surface of the substrate and toward an outer edge of the substrate is then created. The shear force may result from a normal or tangential component of a force applied to a solid body in contact with the fluid layer in one embodiment. The surface of the substrate is rinsed to remove the fluid layer. A cleaning system and apparatus are also provided. |
| 申请公布号 |
US2015040941(A1) |
申请公布日期 |
2015.02.12 |
| 申请号 |
US201313961821 |
申请日期 |
2013.08.07 |
| 申请人 |
Lam Research Corporation |
发明人 |
Freer Erik M.;deLarios John M.;Mikhaylichenko Katrina;Ravkin Michael;Korolik Mikhail;Redeker Fred C. |
| 分类号 |
H01L21/67 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for cleaning a substrate, comprising method operations of:
disposing a fluid layer having solid components therein to a surface of the substrate; creating a shear force directed substantially parallel to the surface of the substrate and toward an outer edge of the substrate, the shear force resulting from one of a normal component or a tangential component of a force applied to a solid body in contact with the fluid layer; and rinsing the surface of the substrate to remove the fluid layer. |
| 地址 |
Fremont CA US |
