| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor strip capable of suppressing breakage of the semiconductor strip, a circuit board and electronic equipment.SOLUTION: The method for manufacturing a semiconductor strip comprises: a step of forming a trench at a front surface side on the front surface of a semiconductor; a step of forming a trench at a back surface side reaching to the trench at the front surface side by a rotating cutting tool having a thickness being thicker than a width of the trench at the front surface side from the back surface of the substrate, and dicing the substrate into a semiconductor strip having a step formed by a difference between the width of the trench at the front surface side and the width of the trench at the back surface side; and a step that is a processing step of previously processing the tip of the cutting tool before forming the trench at the back surface side, and of tapering the cutting tool having a tip applying stress being larger than stress which damage the step, to a bottom region of the step and processing the cutting tool until the degree of taper reaches to the degree that does not damage the step by the stress applied to the bottom region. |
