| 摘要 |
To provide a light emitting diode package of which the height of protrusion of a thermal via is decreased without decreasing the flexural strength of an insulating substrate. A light emitting diode package comprising a light emitting diode element mounted on a substrate, wherein the substrate is obtained by firing a glass ceramic composition containing a powder of glass containing, as represented by mole percentage, from 57 to 65% of SiO 2 , from 13 to 18% of B 2 O 3 , from 9 to 23% of CaO, from 3 to 8% of Al 2 O 3 and from 0.5 to 6% of at least one of K 2 O and Na 2 O in total, and a ceramic filler. |
