| 摘要 |
PROBLEM TO BE SOLVED: To provide a photocurable resin composition having such characteristics that even a solder resist cured film of the resin composition after cured with UV rays or cured by heat can be peeled from a substrate by use of an alkali aqueous solution and the substrate can be reused, and to provide a dry film and a cured product obtained from the above composition, and a printed wiring board on which a cured film of a solder resist or the like comprising the above dry film or the cured product is formed.SOLUTION: A photocurable resin composition contains one or more compounds of (B) a carboxylic acid resin, (C) poly(meth)acrylate, and (D) an epoxy resin, all derived from a compound including a structure expressed by general formula (1), by 20 wt.% or more with respect to organic substances in the composition. In the formula, Rrepresents a polyhydric alcohol derivative having (m+l) hydroxyl groups; Rrepresents one of CH, CH, CH, CH, and a substituted or unsubstituted aromatic ring; and Rrepresents a substituted or unsubstituted aromatic ring. |
