发明名称 部品内蔵樹脂基板
摘要 A component-embedded resin substrate includes a resin structure including a plurality of laminated resin layers and having an end surface surrounding an outer periphery of the resin layers and a plurality of embedded components arranged as embedded in the resin structure. The plurality of embedded components include a first embedded component and a second embedded component. When viewed in a planar view, the first embedded component has a first outer side extending along a portion of an end surface 5 closest to the first embedded component. When viewed in a planar view, the second embedded component has a second outer side extending along a portion of the end surface closest to the second embedded component. When viewed in a planar view, the outer side is oblique to the second outer side.
申请公布号 JP5668866(B2) 申请公布日期 2015.02.12
申请号 JP20130538478 申请日期 2012.09.12
申请人 株式会社村田製作所 发明人 酒井 範夫;大坪 喜人
分类号 H05K3/46;H01L23/12;H05K1/18 主分类号 H05K3/46
代理机构 代理人
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