| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a silver alloy sputtering target for forming a conductive film, which is capable of suppressing splashing, even when a high electric power is applied to a large target due to the size increase of the target, and is capable of forming a film that is excellent in corrosion resistance and heat resistance and has a low electrical resistance, and to provide a method for manufacturing the same. <P>SOLUTION: The silver alloy sputtering target for forming a conductive film comprises a silver alloy having a composition comprising 0.1-1.5 mass% In, 0.05-0.8 mass% Ce and/or Eu in total and the balance being Ag and inevitable impurities, wherein the average grain size of the silver alloy crystal grains is 120-250μm and the variation in the crystal grain size is within≤20% of the average grain size. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
