发明名称 硬化性オルガノポリシロキサン組成物及び半導体装置
摘要 A curable organopolysiloxane composition comprising: (A) a branched-chain organopolysiloxane that contains in one molecule at least three alkenyl groups and at least 30 mole % of all silicon-bonded organic groups in the form of aryl groups; (B) a linear-chain organopolysiloxane that contains aryl groups and has both molecular terminals capped with diorganohydrogensiloxy groups; (C) a branched-chain organopolysiloxane that contains in one molecule at least three diorganohydrogensiloxy groups and at least 15 mole % of all silicon-bonded organic groups in the form of aryl groups; and (D) a hydrosilylation catalyst. The composition is capable of forming a cured body that has a high index of refraction and strong adhesion to substrates.
申请公布号 JP5667740(B2) 申请公布日期 2015.02.12
申请号 JP20080159723 申请日期 2008.06.18
申请人 東レ・ダウコーニング株式会社 发明人 佐川 貴志;吉武 誠
分类号 C08L83/07;C08L83/05;H01L23/29;H01L23/31;H01L33/56 主分类号 C08L83/07
代理机构 代理人
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