| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a ceramic electronic component in which the occurrence of a crack in being solder-mounted on a substrate is prevented.SOLUTION: In a ceramic capacitor 10, plating layers 50A and 50B are distanced from a boundary B1 by the formation of resin portions 40A and 40B. When the ceramic capacitor 10 is solder-mounted on a substrate 11, solder 12 exists apart from the boundary B1 if the solder 12 attaches to surfaces of the plating layers 50A and 50B and extends over the surfaces. For this reason, in the ceramic capacitor 10, stress occurring in the substrate 11 is hard to transmit to the vicinity of the boundary B1 when deformation occurs in the substrate 11, and the stress reaching to the vicinity of the boundary B1 is relaxed, which prevents the occurrence of a crack C originating from the vicinity of the boundary B1.</p> |
