| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a support table that can uniform temperature distribution over an inner peripheral portion of a semiconductor wafer to a higher degree during deposition and that can inhibit growth of a film on a movable member. <P>SOLUTION: A support table on which a wafer 70 is placed during deposition comprises a placement member 40 and a movable member 30. The placement member 40 includes a first support face 44 supporting a periphery of a rear face of the wafer 70 when the wafer 70 is placed. The movable member 30 includes a second support face 34 supporting the periphery of the rear face of the wafer 70 when the wafer 70 is transported. The second support face 34 is positioned on the outer periphery side extending beyond an inner peripheral end 44a of the first support face 44. The movable member 30 is movable between an upper position and a lower position. The whole movable member 30 is positioned within a range overlapping with the wafer 70 when the wafer 70 supported by the first support face 44 is viewed in a plan view. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
