SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

摘要

A semiconductor package includes a first package comprising a circuit board and a first semiconductor die mounded on the circuit board, and a second package comprising a mounting board. At least one second semiconductor die may be mounted on the mounting board, and one or more leads may be electrically connected to the mounting board and/or the second semiconductor die. An adhesion member may bond the first package to the second package, and an encapsulant may encapsulate the first package and the second package. the circuit board, the mounting board, and the one or more leads may be arranged to surround the first semiconductor die and the second semiconductor die, and the plurality of leads may be electrically connected to the circuit board and to a constant potential or ground, to reduce the effects of external electromagnetic interference upon the semiconductor package.

主权项

1. A semiconductor package comprising:
a first package comprising a circuit board and a first semiconductor die mounted on the circuit board; a second package comprising a mounting board, at least one second semiconductor die mounted on the mounting board, and a plurality of leads electrically connected to the mounting board and/or the second semiconductor die; an adhesion member bonding the first package to the second package; and an encapsulant encapsulating the first package and the second package, wherein the circuit board, the mounting board, and the plurality of leads are arranged to surround the first semiconductor die and the second semiconductor die, and the plurality of leads are electrically connected to the circuit board.