HIGH-FREQUENCY MODULE

摘要

A high-frequency module includes a multilayer substrate, a filter substrate, a cover layer, a connection electrode, and inductors. The filter substrate includes a first principal surface on which an IDT electrode included in a filter unit is disposed, and the first principal surface faces a mounting surface of the multilayer substrate. The cover layer is spaced apart from and opposite to the first principal surface of the filter substrate. The connection electrode connects the multilayer substrate and the filter substrate. One of the inductors is connected between the filter unit and a first external connection terminal. Another one of the inductors is connected between the filter unit and the ground. The inductors are disposed inside the multilayer substrate. The inductors are inductively coupled to each other.

主权项

1. A high-frequency module comprising:
a first external connection terminal; a second external connection terminal; a filter unit connected between the first and second external connection terminals; a matching circuit connected between the filter unit and at least one of the first and second external connection terminals; an inductor connected between the filter unit and a ground; a multilayer substrate; a flat filter substrate including a first principal surface on which an IDT electrode included in the filter unit is disposed, the first principal surface facing a mounting surface of the multilayer substrate; a flat cover layer spaced apart from and opposite to the first principal surface of the filter substrate; and a connection electrode having a configuration that protrudes from the first principal surface and that extends through the cover layer and connecting the multilayer substrate and the filter substrate; wherein the matching circuit is disposed inside the multilayer substrate or the cover layer; and the inductor and the matching circuit are inductively or capacitively coupled to each other.