发明名称 |
SILICON CARBIDE SEMICONDUCTOR SUBSTRATE, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING SILICON CARBIDE SEMICONDUCTOR DEVICE |
摘要 |
This silicon carbide semiconductor substrate comprises a base substrate (1) made from single crystal silicon carbide and having a principal surface area with an outer diameter of 100mm or more, and an epitaxial layer (2) formed on the principal surface (1A). The silicon carbide semiconductor substrate (10) has a warpage of -100μm to 100μm when the substrate temperature is at room temperature, and from -1.5mm to 1.5mm when the substrate temperature is 400°C. |
申请公布号 |
WO2015019707(A1) |
申请公布日期 |
2015.02.12 |
申请号 |
WO2014JP65712 |
申请日期 |
2014.06.13 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
HORII, TAKU;KUBOTA, RYOSUKE;MASUDA, TAKEYOSHI |
分类号 |
H01L21/20;H01L21/205;H01L21/265;H01L21/336;H01L29/06;H01L29/12;H01L29/78 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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