| 摘要 |
<p>A ceramic electrostatic chuck according to the present invention includes a dielectric layer with a support layer in contact with the back side of the dielectric layer, and an embedded electrostatic electrode. A wafer is placed on the dielectric layer and the dielectric layer is formed of sintered aluminum nitride containing Sm and has a volume resistivity in the range of 4×109 to 4×1010Ωcm at room temperature. The support layer is formed of sintered aluminum nitride containing Sm and Ce and has a volume resistivity of 1×1013Ωcm or more at room temperature.</p> |
