| 摘要 |
1277448 Soldering RCA CORPORATION 14 Aug 1969 [21 Aug 1968] 40620/69 Heading B3R In removing a component having connections soldered to a substrate, the component is connected to a tension applying device and the connectins are heated to melt the solder, the device then removing the component from the substrate. A fountain type solder pot 10, Fig. 1, has a cap 12 over the head 13 with an orifice 14 to constrict the solder output produced by a motor driven pump 18. A masking plate 20 is arranged above the pot and has pads 36 co-operating with springs 38 to permit movement of the plate towards the pot. The plate 20 has an opening 22 above the orifice 14 and has holes 26 surrounded by a gasket 22 to receive locating pins of a movable stop 30. The tension applying device has a body 40, Fig. 3, with side panels 44 and a slot 42 spanned by a steel strip 46 forming a stop for a loop of a spring assembly 48. A second spring 50 is interlocked with the loop of assembly 48 and can be easily secured about a component 34 and a cover 52 has a lip 54 fitting in the groove 42 beneath the strip 46. In operation the stop 30 is positioned and a substrate is fitted against it so that the component to be removed is centred over the aperture 22. The tension device is placed on the substrate and the spring 48 is tensioned, the spring 50 is placed about the component and the lip 54 is slipped into the groove 42. The pump 18 is started, pressure is applied to the member 52 to compress the springs 38 and bring the under surface of the substrate about the component into contact with molten solder pumped through the orifice and when the solder connections melt the spring assembly 48 causes the component to be removed. A radiant or infra-red heating source may be employed as alternatives. |
