| 摘要 |
<p>A tilt sensor package according to the present invention comprises: a PCB having multiple multi-layered traces therein; and a tilt sensor having multiple contact points capable of being connected to an external electrode. According to the present invention, the traces are connected to the contact points after the traces are exposed through drilling the inside of the PCB and the tilt sensor is positioned in a space in the PCB, so the tilt sensor and the PCB can be mutually connected stably to improve the reliability of an element compared with connection through vias.</p> |
