发明名称 sensor module with contact spring
摘要 <p>The purpose of the present invention is to prevent deformation caused by wear of an inner plastic support of spring contact due to repetitive reciprocating motion of a spring and unstable contact of a two-stage thickness spring structure for separation prevention of a spring; and to fundamentally prevent electrical contact malfunction caused by dust generated by wear of a plastic support. To achieve the objective of the present invention, a separation prevention bump or a metal contact cap can be used for preventing a spring from being separated while the spring is stably in contact with an outside by manufacturing the spring with a predetermined thickness to widen an electrical contact area with the outside. The present invention has an effect of transmitting a stable electrical signal by contact and connection while structural deformation of an inside is not generated despite repetitive reciprocating motion, and by connecting an electrical signal such as a sensor, etc. while a stable contact state is maintained in conditions that a lot of vibration is generated.</p>
申请公布号 KR20150016183(A) 申请公布日期 2015.02.11
申请号 KR20140145043 申请日期 2014.10.24
申请人 发明人
分类号 G01D11/00;G01D21/00;H01R13/15 主分类号 G01D11/00
代理机构 代理人
主权项
地址