发明名称 LED CHIP-ON-BOARD TYPE RIGID FLEXIBLE PCB AND RIGID FLEXIBLE HEAT SPREADER SHEET PAD AND HEAT-SINK STRUCTURE USING THE SAME
摘要 The present invention relates to a chip-on-board type flexible PCB (Chip on Board[COB] type LED) where LED light emitting chips are arranged, and a rigid flexible heat spreader sheet pad arranged on the PCB and an LED heat spreading structure using the same. A chip-on-board type flexible PCB includes a flexible metal foil which includes a chip-on-board type LED where LED light emitting chip die is attached to a circuit pattern; a circuit pattern which has a circuit formed by patterning the upper surface of the flexible metal foil; an LED chip which includes a die attached onto the circuit pattern and is arranged along a predetermined design position; and an insulator; and a flexible heat spreader pod which conducts heat by corresponding to the bottom surface of the flexible metal foil, thereby providing high heat spreading property to a high power or a lower power COB LED and applying it to various LED products.
申请公布号 KR20150015900(A) 申请公布日期 2015.02.11
申请号 KR20130091930 申请日期 2013.08.02
申请人 发明人
分类号 H01L33/48;H01L33/64 主分类号 H01L33/48
代理机构 代理人
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