| 摘要 |
<p>A micro-fabricated device (100, 300, 400, 500), includes a support structure (140, 240, 340, 440, 540) having an aperture (142, 242, 342, 442, 542) formed therein, and a device substrate (130, 230, 330, 430, 530) disposed within the aperture. The micro-fabricated device further includes a thermally isolating structure (120, 220, 320, 420, 520) thermally coupling the device substrate to the support structure. The thermally isolating structure includes at least one n-doped region (152, 252, 352, 452, 452') and at least one p-doped region (154, 254, 354, 454, 454') formed on or in the thermally isolating structure and separated from each other. In addition, the thermally isolating structure includes an electrical interconnect (156, 256, 356, 456) connecting at least one n-doped region and at least one p-doped region, forming an integrated thermoelectric device.</p> |
