| 摘要 |
<p>The present invention relates to a method for manufacturing a printed circuit board comprises the steps of: in a semi-active method, performing chemical copper plating (4) on an insulating layer (3) or forming a copper thin film on the insulating layer (3) by a sputtering method; roughening the obtained copper surface (4) using an etching solution containing 0.1 to 3% by mass of hydrogen peroxide, 0.3 to 5% by mass of sulfuric acid, 0.1 to 3 ppm of halogen ion, and 0.003 to 0.3% by mass of tetrazoles ; attaching dry film resist (5) to the roughened copper surface (4) to perform exposure and development and performing electrolytic copper plating (7) on an opening (6) after the exposure; and stripping the remaining dry film resist using a resist stripper containing 0.5 to 20% by mass of monoethanolamine, 0.2 to 10% by mass of quaternary ammonium hydroxide, 0.01 to 10% by mass of ethylene glycol, and 0.01 to 0.5% by mass of azoles.</p> |
