| 发明名称 | Submount layers configured to enhance absorption of light proximate a bonding feature | ||
| 摘要 | An apparatus includes a submount having a mounting surface and a top surface opposite the mounting surface. A slider has a bonding feature that interfaces with the mounting surface of the submount, and two or more layers are disposed between the mounting surface of the submount and the bonding feature. The two or more layers are configured to enhance light absorption of light in proximity to the bonding feature. The light originates from a source of electromagnetic energy that illuminates the top surface of the submount. | ||
| 申请公布号 | US8953421(B2) | 申请公布日期 | 2015.02.10 |
| 申请号 | US201313930350 | 申请日期 | 2013.06.28 |
| 申请人 | Seagate Technology LLC | 发明人 | Peng Chubing;Seigler Michael Allen |
| 分类号 | G11B11/00;G11B13/04 | 主分类号 | G11B11/00 |
| 代理机构 | Hollingsworth Davis, LLC | 代理人 | Hollingsworth Davis, LLC |
| 主权项 | 1. An apparatus comprising: a submount having a mounting surface and a top surface opposite the mounting surface; a slider having a bonding feature that interfaces with the mounting surface of the submount; and two or more layers disposed between the mounting surface of the submount and the bonding feature, the layers configured to enhance absorption of light in proximity to the bonding feature, the light originating from a source of electromagnetic energy that illuminates the top surface of the submount. | ||
| 地址 | Cupertino CA US | ||