发明名称 Systems and methods for encapsulating electronics in a mountable device
摘要 A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure has a first side defined by a first layer of bio-compatible material, a second side defined by a second layer of bio-compatible material, an electronic component, and a conductive pattern that defines sensor electrodes. A portion of the second layer of bio-compatible material is removed by etching to create at least one opening in the second side in which the sensor electrodes are exposed. The etching further removes a portion of the first layer of bio-compatible material so as to create at least one opening in the first side that is connected to the at least opening in the second side. With this arrangement of openings, analytes can reach the sensor electrodes from either the first side or the second side of the bio-compatible structure.
申请公布号 US8950068(B2) 申请公布日期 2015.02.10
申请号 US201314032428 申请日期 2013.09.20
申请人 Google Inc. 发明人 Etzkorn James
分类号 H05K3/30;A61B5/145;A61B5/1473;A61B5/00;H05K3/32 主分类号 H05K3/30
代理机构 McDonnell Boehnen Hulbert & Berghoff LLP 代理人 McDonnell Boehnen Hulbert & Berghoff LLP
主权项 1. A method for fabricating a mountable device, the method comprising: fabricating a bio-compatible structure that has a first side and a second side opposite the first side and includes an electronic component and a conductive pattern, wherein fabricating the bio-compatible structure comprises: forming a first layer of a bio-compatible material on a working substrate, wherein the first layer of the bio-compatible material defines the first side of the bio-compatible structure;forming the conductive pattern on the first layer of the bio-compatible material, wherein the conductive pattern defines sensor electrodes, electrical contacts, and electrical interconnects between the sensor electrodes and the electrical contacts;mounting the electronic component on the electrical contacts;forming a second layer of the bio-compatible material over the first layer of the bio-compatible material, the conductive pattern, and the electronic component, wherein the second layer of the bio-compatible material defines the second side of the bio-compatible structure;removing a portion of the second layer of the bio-compatible material to create at least one opening in the second side of the bio-compatible structure and removing a portion of the first layer of the bio-compatible material to create at least one opening in the first side of the bio-compatible structure, such that the sensor electrodes are exposed in the at least one opening in the second side and the at least one opening in the first side is connected to the at least one opening in the second side; andafter removing the portions of the first and second layers of the bio-compatible material, releasing the first layer of the bio-compatible material from the working substrate; and surrounding the bio-compatible structure with a polymer, wherein the polymer defines at least one mounting surface of the mountable device.
地址 Mountain View CA US