| 摘要 |
<p>Provided is a substrate treating apparatus using process gas. The substrate treating apparatus includes a chamber, a susceptor which supports a substrate in the chamber, a heating unit which heats the substrate placed on the susceptor, and a blocking plate which is located between the susceptor and a heater and protects the heater. The surfaces of the blocking plate have different roughness (Ra) and different materials according to each region. The surfaces of the blocking plate have surface roughness (Ra) of a preset value or more.</p> |
