发明名称 Light-emitting element mounting package, light-emitting element package, and method of manufacturing these
摘要 A light-emitting element mounting package includes a light-emitting element mounting portion that includes a plurality of wiring portions arranged interposing a predetermined gap between the wiring portions facing each other, and an insulating layer on which the light-emitting element mounting portion is mounted, wherein an upper surface of the light-emitting element mounting portion is exposed on the insulating layer, wherein cutout portions are formed on lower sides of side edges of the wiring portions and contact the insulating layer.
申请公布号 US8952408(B2) 申请公布日期 2015.02.10
申请号 US201213710648 申请日期 2012.12.11
申请人 Shinko Electric Industries Co., Ltd. 发明人 Denda Tatsuaki;Kobayashi Kazutaka
分类号 H01L33/00;H01L33/60;H05K1/02;H01L21/50;H05K1/11 主分类号 H01L33/00
代理机构 IPUSA, PLLC 代理人 IPUSA, PLLC
主权项 1. A light-emitting element mounting package comprising: a metallic plate; an insulating layer that is laminated on the metallic plate; a plurality of wiring portions that are laminated on the insulating layer; and a reflective film that is formed on the insulating layer and the wiring portions wherein the plurality of wiring portions are arranged interposing a predetermined gap between the wiring portions adjacent each other, wherein a light-emitting element mounting area is formed on partial areas of upper surfaces of a pair of adjacent wiring portions included in the plurality of wiring portions and is covered with a plating film, wherein a part of an upper surface of the light-emitting element mounting area is exposed on the insulating layer, wherein cutout portions are formed on lower sides of side edges of the wiring portions and are embedded in the insulating layer and are covered with the insulating layer, and parts of the wiring portions positioned above the cutout portions of the wiring portions are exposed on the insulating layer, wherein the reflective film has opening portions through which a part of the light-emitting element mounting area is exposed.
地址 Nagano JP