| 发明名称 | Wiring board and method for manufacturing wiring board | ||
| 摘要 | A wiring board includes a substrate having a cavity, and an electronic component accommodated in the cavity of the substrate. The substrate has a thickness which is greater than a thickness of the electronic component such that a ratio of the thickness of the substrate to the thickness of the electronic component is set in a range of 0.3 or greater and 0.7 or less. | ||
| 申请公布号 | US8952507(B2) | 申请公布日期 | 2015.02.10 |
| 申请号 | US201313963246 | 申请日期 | 2013.08.09 |
| 申请人 | Ibiden Co., Ltd. | 发明人 | Shimabe Toyotaka;Shimizu Keisuke;Furutani Toshiki |
| 分类号 | H01L23/00;H05K1/18;H01L23/495;H01L23/31;H01L23/498;H01L21/48;H01L21/56 | 主分类号 | H01L23/00 |
| 代理机构 | Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. | 代理人 | Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. |
| 主权项 | 1. A wiring board, comprising: a substrate having a cavity, a first surface and a second surface on an opposite side of the first surface; an electronic component accommodated in the cavity of the substrate; and an insulation layer formed on the first surface of the substrate such that the insulation layer is covering an opening of the cavity, wherein the substrate has a thickness which is greater than a thickness of the electronic component such that a ratio of the thickness of the substrate to the thickness of the electronic component is set in a range of 0.3 or greater and 0.7 or less, and the electronic component is positioned in the cavity of the substrate such that a distance from the first surface of the substrate to the electronic component is set less than a distance from the second surface of the substrate to the electronic component. | ||
| 地址 | Ogaki-shi JP | ||