| 发明名称 | Infrared sensor module | ||
| 摘要 | An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device. | ||
| 申请公布号 | US8952331(B2) | 申请公布日期 | 2015.02.10 |
| 申请号 | US201013513426 | 申请日期 | 2010.12.17 |
| 申请人 | Panasonic Corporation | 发明人 | Ueda Mitsuhiko;Okubayashi Takami;Sugiyama Takanori;Sanagawa Yoshiharu;Aketa Takanori;Nakamura Yushi;Kirihara Masao |
| 分类号 | G01J5/20;G01J5/16;G01J5/02;G01J5/04;G01J5/08 | 主分类号 | G01J5/20 |
| 代理机构 | Greenblum & Bernstein, P.L.C. | 代理人 | Greenblum & Bernstein, P.L.C. |
| 主权项 | 1. An infrared sensor module comprising: an infrared sensor device disposed on a sensor region of a substrate; a signal processing circuit configured to process an output from the infrared sensor device, the signal processing circuit being disposed on a thin region of the substrate; and a case provided at a predetermined distance from the infrared sensor device, the case comprising a window, and accommodating the infrared sensor device and the signal processing circuit, wherein a thickness of the thin region of the substrate is smaller than a thickness of the sensor region of the substrate. | ||
| 地址 | Osaka JP | ||