Method of fabricating a flip chip semiconductor die with internal signal access

摘要

A device and method for providing access to a signal of a flip chip semiconductor die. A hole is bored into a semiconductor die to a test probe point. The hole is backfilled with a conductive material, electrically coupling the test probe point to a signal redistribution layer. A conductive bump of the signal redistribution layer is electrically coupled to a conductive contact of a package substrate. An external access point of the package substrate is electrically coupled to the conductive contact, such that signals of the flip chip semiconductor die are accessible for measurement at the external access point.

主权项

1. A semiconductor fabrication method:
forming electronic circuits in said semiconductor die; forming a test pad in said semiconductor die for access by drilling and conductive material backfill; depositing a test signal redistribution layer comprising conductive traces on said semiconductor die, said test signal redistribution layer electrically coupled to said test pad, wherein said depositing said test signal redistribution layer comprises: fabricating said conductive traces in a spiral pattern; fabricating a plurality of conductive fingers extending from said conductive traces, such that a larger area of said semiconductor die is accessed; and fabricating a conductive bump for conveying a signal to an external access point on a package substrate, said conductive bump located on a first surface of said semiconductor die and electrically coupled to said test signal redistribution layer.