发明名称 Liquid processing apparatus, liquid processing method and computer-readable storage medium storing liquid processing program
摘要 There is provided a liquid processing method for performing a liquid process on a front surface of a substrate by using a processing solution and then performing a rinse process on the front surface of the substrate by using a rinse solution having a temperature lower than a temperature of the processing solution. The liquid processing method includes performing an intermediate process between the liquid process and the rinse process, for adjusting a temperature of the front surface of the substrate to a temperature higher than the temperature of the rinse solution and lower than the temperature of the processing solution.
申请公布号 US8951359(B2) 申请公布日期 2015.02.10
申请号 US201113106972 申请日期 2011.05.13
申请人 Tokyo Electron Limited 发明人 Inada Takao;Okamura Naoyuki;Yano Hidetsugu;Hachiya Yosuke
分类号 B08B7/00;B08B7/04;B08B3/00;H01L21/67 主分类号 B08B7/00
代理机构 Pearne & Gordon LLP 代理人 Pearne & Gordon LLP
主权项 1. A liquid processing apparatus that performs a liquid process on a front surface of a substrate by using a processing solution and then performs a rinse process on the front surface and a rear surface of the substrate by using a rinse solution, the apparatus comprising: a substrate holding unit capable of holding the substrate; a processing solution supply unit capable of supplying the processing solution to the front surface of the substrate so as to perform the liquid process on the substrate; a rinse solution supply unit capable of supplying the rinse solution to the front and the rear surfaces of the substrate so as to perform the rinse process on the substrate; and a control unit configured to adjust a temperature of the substrate to a temperature higher than the temperature of the rinse process and lower than the temperature of the liquid process, between the liquid process and the rinse process performed on the substrate, wherein the rinse solution supply unit comprises: a first rinse solution supply source and a second rinse solution supply source for supplying the rinse solution; a flow path switching valve connected with the first rinse solution supply source and the second rinse solution supply source; a heater for heating the rinse solution of the second rinse solution supply source, the heater being installed between the second rinse solution supply source and the flow path switching valve, wherein the heater heats the rinse solution of the second rinse solution supply source to the temperature higher than the temperature of the rinse process and lower than the temperature of the liquid process; a first rinse solution supply pipe for supplying the rinse solution to the front surface of the substrate, the first rinse solution supply pipe being connected with the flow path switching valve; a second rinse solution supply pipe for supplying the rinse solution to the rear surface of the substrate, the second rinse solution supply pipe being connected with the flow path switching valve; a first opening/closing valve installed at the first rinse solution supply pipe; and a second opening/closing valve installed at the second rinse solution supply pipe, wherein the control unit is configured to control the heater, and the flow path switching valve to be switched to the second rinse solution supply source and to control the second opening/closing valve to be opened, so that heated rinse solution heated to the temperature higher than the temperature of the rinse process and lower than the temperature of the liquid process is supplied to the rear surface of the substrate after performing the liquid process and before performing the rinse process, and the control unit is configured to control the flow path switching valve to be switched to the first rinse solution supply source and to control the first and second opening/closing valves to be opened, so that the rinse solution is supplied to the front and rear surfaces of the substrate when performing the rinse process.
地址 Tokyo JP