发明名称 |
Integrated circuit combination of a target integrated circuit and a plurality of cells connected thereto using the top conductive layer |
摘要 |
A target integrated circuit (TIC) having a top conductive layer (TCL) that may be connected to a plurality of cells that are further integrated over the TIC. Each of the plurality of cells comprises two conductive layers, a lower conductive layer (LCL) below the cell and an upper conductive layer (UCL) above the cell. Both conductive layers may connect to the TCL of the TIC to form a super IC structure combined of the TIC and the plurality of cells connected thereto. Accordingly, conductivity between the TIC as well as auxiliary circuitry to the TIC maybe achieved. |
申请公布号 |
US8952473(B2) |
申请公布日期 |
2015.02.10 |
申请号 |
US201113270869 |
申请日期 |
2011.10.11 |
申请人 |
Sol Chip Ltd. |
发明人 |
Keysar Shani;Holzer Reuven;Navon Ofer;Friedlander Rami |
分类号 |
H01L27/14;H01L25/16;H01L31/0392 |
主分类号 |
H01L27/14 |
代理机构 |
M&B IP Analysts, LLC |
代理人 |
M&B IP Analysts, LLC |
主权项 |
1. A self-powering integrated circuit comprising:
a thin film target integrated circuit (TIC) having at least an electrical circuit deposited upon a semiconductor substrate wherein the TIC further comprises a top conducting layer (TCL) formed within; and a plurality of thin film cell structures deposited over the TIC, wherein each of the plurality of cell structures comprising at least a lower conducting layer (LCL) and an upper conducting layer (UCL), at least one of the plurality of thin film cell structures connected to the TIC for the self-powering the at least electric circuit of the TIC, wherein at least a first cell structure of the plurality of cell structures is coupled to a second cell structure of the plurality of cell structures using a conducting path connecting at least a LCL of the at least first cell structure of the plurality of cell structures through a first connector to an upper surface of the TCL and from the upper surface of the TCL through a second connector to at least one UCL of the second cell structure of the plurality of cell structures. |
地址 |
Haifa IL |