| 发明名称 | MEMS devices, packaged MEMS devices, and methods of manufacture thereof | ||
| 摘要 | MEMS devices, packaged MEMS devices, and methods of manufacture thereof are disclosed. In one embodiment, a microelectromechanical system (MEMS) device includes a first MEMS functional structure and a second MEMS functional structure. An interior region of the second MEMS functional structure has a pressure that is different than a pressure of an interior region of the first MEMS functional structure. | ||
| 申请公布号 | US8952465(B2) | 申请公布日期 | 2015.02.10 |
| 申请号 | US201213549095 | 申请日期 | 2012.07.13 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Liang Kai-Chih;Cheng Chun-Wen |
| 分类号 | H01L29/84 | 主分类号 | H01L29/84 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A microelectromechanical system (MEMS) device, comprising: a first MEMS functional structure having an interior region, the interior region sealed by a first sealing ring; a shallow trench underlying the first sealing ring; and a second MEMS functional structure, wherein an interior region of the second MEMS functional structure is sealed by a second sealing ring and has a pressure that is different than a pressure of the interior region of the first MEMS functional structure. | ||
| 地址 | Hsin-Chu TW | ||