发明名称 Semiconductor devices including an electrically percolating source layer and methods of fabricating the same
摘要 Various embodiments are provided for semiconductor devices including an electrically percolating source layer and methods of fabricating the same. In one embodiment, a semiconductor device includes a gate layer, a dielectric layer, a memory layer, a source layer, a semiconducting channel layer, and a drain layer. The source layer is electrically percolating and perforated. The semiconducting channel layer is in contact with the source layer and the memory layer. The source layer and the semiconducting channel layer form a gate voltage tunable charge injection barrier.
申请公布号 US8952361(B2) 申请公布日期 2015.02.10
申请号 US201113580199 申请日期 2011.03.04
申请人 University of Florida Research Foundation, Inc. 发明人 Rinzler Andrew Gabriel;Liu Bo;McCarthy Mitchell Austin
分类号 H01L35/24;H01L51/05;B82Y10/00;H01L51/00 主分类号 H01L35/24
代理机构 Wolf, Greenfield & Sacks, P.C. 代理人 Wolf, Greenfield & Sacks, P.C.
主权项 1. A semiconductor device, comprising: a gate layer formed on a substrate; a dielectric layer formed on the gate layer; a memory layer formed on the dielectric layer; a source layer formed on the memory layer, where the source layer is electrically percolating and perforated; a semiconducting channel layer formed on the source layer, where the semiconducting channel layer is in contact with the source layer and the memory layer, and where the source layer and the semiconducting channel layer form a gate voltage tunable charge injection barrier; and a drain layer formed on the semiconducting channel layer.
地址 Gainesville FL US