| 摘要 |
<p>The invention relates to a thermal-release adhesive tape and a cutting method of an electronic component. An object of the invention is to provide an adhesive tape capable of fully fixing a chip even when being cut off, preventing chip flyoff in a cutting process, and increasing yield of the chip in the cutting process. The thermal-release adhesive tape has a thermal-expansion adhesive layer. When a probe tack value of the thermal-expansion adhesive is set as B0 and the probe tack value of the thermal-expansion adhesive after being stood for 1 week at a temperature of 0 DEG C as B, a variable rate of the probe tack value shown as a formula 1 is below 19.0%. W=|(B0-B)/B0*100|</p> |
