Semiconductor power modules and devices

摘要

An electronic component is described which includes a first transistor encased in a first package, the first transistor being mounted over a first conductive portion of the first package, and a second transistor encased in a second package, the second transistor being mounted over a second conductive portion of the second package. The component further includes a substrate comprising an insulating layer between a first metal layer and a second metal layer. The first package is on one side of the substrate with the first conductive portion being electrically connected to the first metal layer, and the second package is on another side of the substrate with the second conductive portion being electrically connected to the second metal layer. The first package is opposite the second package, with at least 50% of a first area of the first conductive portion being opposite a second area of the second conductive portion.

主权项

1. A half bridge, comprising:
a first switch encased in a first package, the first package comprising a first conductive portion having a first area, the first transistor being mounted over the first conductive portion; a second transistor encased in a second package, the second package comprising a second conductive portion having a second area, the second transistor being mounted over the second conductive portion; and a substrate comprising an insulating layer and a metal layer; wherein the first package is on a first side of the substrate and the second package is on a second side of the substrate; and the first package is opposite the second package, with at least 50% of the first area of the first conductive portion being opposite the second area of the second conductive portion.