Reaction apparatus for processing wafer, electrostatic chuck and wafer temperature control method

摘要

This invention discloses a reaction apparatus for wafer treatment, an electrostatic chuck and a wafer temperature control method, in the field of semiconductor processing. The electrostatic chuck comprises an insulating layer for supporting a wafer and a lamp array disposed in the insulating layer. Each lamp of the lamp array can be independently controlled to turn on and off and/or to adjust the output power. By controlling the on/off switch and/or output power of each lamp of the lamp array the temperature of the wafer held on the ESC is adjusted and temperature non-uniformity can be more favorably adjusted, greatly improving wafer temperature uniformity, particularly alleviating non-radial temperature non-uniformity.

主权项

1. An electrostatic chuck (ESC) for holding a wafer, comprising:
an insulating layer for supporting a wafer; and a lamp array disposed in the insulating layer.