| 摘要 |
<p>In the present invention, provided is an epoxy resin composition to encapsulate semiconductor devices with excellent flame retardancy. More specifically, the present invention relates to an epoxy resin composition to encapsulate semiconductor devices including an epoxy resin, a hardener, a hardening accelerator, an inorganic filler and an adhesion improving agent, wherein the adhesion improving agent includes a compound denoted by chemical formula 5, and the epoxy resin composition has an excellent adhesion to lead frames and an outstanding reliability of package. In chemical formula 5, R1 and R2 are a substituted or unsubstituted C1-C20 alkyl group, a substituted or unsubstituted C2-C20 alkenyl group, substituted or unsubstituted C2-C20 alkynyl group, a substituted or unsubstituted C3-C30 cycloalkyl group, a substituted or unsubstituted C3-C30 cylcloalkenyl group, a substituted or unsubstituted C3-C30 cycloalkynyl group or a substituted or unsubstituted C6-C30 aryl group, independently.</p> |
