发明名称 ROUGHENING COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD
摘要 <p>The present invention provides a roughening copper foil, a copper foil laminate, and a printed wiring board. The present invention reduces the transmission loss of an electric signal and maintains a specific peel strength even if the electric signal of a high frequency is transmitted. The present invention includes: a base material; and a plating layer having a base plating layer which is solidified on a main surface of at least one base material, and a roughening plating layer. After final annealing process, a plating layer solidifying surface is greater than 80% of total orientation ratio of a cube set which is indicated by multiplying a peak strength ratio (A), a surface external orientation ratio (B), and a surface internal orientation ratio (C). When the frequency of the electric signal is f, the thickness of the plating layer is between 0.4μm and 6.3/ (f)^1/2μm, and the score 10 average illumination (Rz) of the surface of the plating layer is between 0.6μm and 1.2μm.</p>
申请公布号 KR20150014850(A) 申请公布日期 2015.02.09
申请号 KR20140088795 申请日期 2014.07.15
申请人 发明人
分类号 C25D7/06;H05K1/09 主分类号 C25D7/06
代理机构 代理人
主权项
地址