| 摘要 |
The present invention provides a polishing composition that can suppress generation of bumps due to etching on a surface of an object to be polished having a germanium material-containing part during the polishing of the object. The polishing composition of the present invention contains abrasive grains, an oxidant and a water-soluble polymer. The water-soluble polymer may be a water-soluble polymer such that 5,000 or more molecules are adsorbed per 1 μm2 of the surface area of the abrasive grains. Alternatively, the water-soluble polymer may be a compound that reduces the water contact angle of the germanium material-containing part of the object to be polished after the object has been polished by using the polishing composition. |
