| 摘要 |
Provided is a semiconductor package. The semiconductor package includes: a core part which includes an upper side and a lower side facing the upper side and has a penetration region; at least one line layer arranged on the lower side of the core part; a first semiconductor chip which is embedded in the penetration region of the core with a flip chip method to electrically connect line layers in the lower side direction of the core part; a chip pad which covers the firs semiconductor chip and part of the upper side of the core part; and ball pads arranged on the upper side of the core part. The chip pad and the ball pads are in the same level. |
