| 摘要 |
<p>A semiconductor die for a wafer level package for securing a mirror-type component according to the present invention, in a semiconductor die for a wafer level package, includes: multiple first bump under bump metal parts (UBM) which are electrically connected to an IC formed on the upper side of a semiconductor die; multiple penetration electrodes which are respectively connected to the first bump under bump metal parts and penetrate the semiconductor die; and multiple second under bump metal parts (UBM) which are formed on the lower side of the semiconductor die and are respectively connected to the penetration electrode. A general-type component and a mirror-type component can be manufactured by a semiconductor die design without changing the design of the semiconductor die.</p> |
