发明名称 COMPACT THREE DIMENSIONAL VERTICAL NAND AND METHOD OF MAKING THEREOF
摘要 A NAND device has at least a 3×3 array of vertical NAND strings in which the control gate electrodes are continuous in the array and do not have an air gap or a dielectric filled trench in the array. The NAND device is formed by first forming a lower select gate level having separated lower select gates, then forming plural memory device levels containing a plurality of NAND string portions, and then forming an upper select gate level over the memory device levels having separated upper select gates.
申请公布号 US2015037950(A1) 申请公布日期 2015.02.05
申请号 US201414517122 申请日期 2014.10.17
申请人 Sandisk Technologies Inc. 发明人 Alsmeier Johann;Makala Raghuveer S.;Costa Xiying;Zhang Yanli
分类号 H01L27/115;H01L29/66 主分类号 H01L27/115
代理机构 代理人
主权项 1. A method of making an array of monolithic three dimensional vertical NAND strings, comprising: forming a lower select gate level over a substrate, the lower select gate level comprising lower portions of a plurality of semiconductor channels, a plurality of lower source or drain electrodes, each lower source or drain electrode electrically connected to each of the plurality of lower portions of the semiconductor channels, and a plurality of lower select gate electrodes, each lower select gate electrode located adjacent to a gate dielectric contacting the lower portion of each semiconductor channel; after the step of forming a lower select gate level, forming a plurality of memory device levels over the lower select gate level, wherein the memory device levels comprise a plurality of NAND string portions; and forming an upper select gate level over the plurality of memory device levels, the upper select gate level comprising upper portions of a plurality of semiconductor channels, a plurality of upper source or drain electrodes, each upper source or drain electrode electrically connected to each of the plurality of upper portions of the semiconductor channels, and a plurality of upper select gate electrodes, each upper select gate electrode located adjacent to a gate dielectric contacting the upper portion of each semiconductor channel.
地址 Plano TX US